點膠機的點膠技術的簡單化！
點膠機這種點膠技術設備簡單，只需采用脈動的空氣壓力和針管就能實現點。它適用于中等粘度的膠體，成本低，操作、維護方便。
Dispensing machine this dispensing technology equipment is simple, only using pulsating air pressure and needle tube can achieve point. It is suitable for medium viscosity colloid with low cost and convenient operation and maintenance.
在半導體封裝設備中，70%以上的點膠機采用這種技術。但是，它也存在不足之處。在點膠過程中，壓縮空氣反復壓縮膠體，會使其產生熱量，從而影響膠體的粘度；隨著針筒內剩余的膠體越來越少，針筒內氣體的體積越來越大，將這些氣體壓縮到一定壓強就需要更多的時間。在高速點膠時，對這些因素的控制更是困難。
In semiconductor packaging equipment, more than 70% of dispensers use this technology. However, it also has shortcomings. In the dispensing process, the compressed air repeatedly compresses the colloid, which will generate heat, thus affecting the viscosity of the colloid; as the remaining colloid in the syringe is less and less, the volume of the gas in the syringe is larger and larger, it will take more time to compress these gases to a certain pressure. When dispensing at high speed, it is more difficult to control these factors.
點膠機在定量點膠過程中，更基本的要求是在整個點膠過程中保持膠體流速和點膠效果一致。膠的有效使用要求摻和許多的因素，包括產品設計問題，來適應充膠工藝和產品需要。隨著電路的密度增加和產品形式因素的，電子工業已出現許許多多的新方法，將芯片級的設計更緊密地與板級裝配結合在一起。
In the process of quantitative dispensing, the most basic requirement of dispensing machine is to keep the gel flow rate and dispensing effect consistent in the whole dispensing process. The effective use of glue requires many factors, including product design, to meet the needs of filling process and products. With the increase of circuit density and the elimination of product form factors, many new methods have emerged in the electronic industry, which combine chip level design with board level assembly more closely.
在某種程度上，諸如倒裝芯片和芯片級包裝等技術的出現事實上已經模糊了半導體芯片、芯片包裝方法與印刷電路板裝配級工藝之間的傳統劃分界線。
To some extent, the emergence of technologies such as flip chip and chip level packaging has in fact blurred the traditional demarcation line between semiconductor chip, chip packaging method and PCB assembly level process.
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